Doil Kong

Doil Kong

Samsung Electronics, South Korea - Gyeonggi / South Korea
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4517859
삼성전자, 한국
person_outline Doil Kong's MOST POPULAR ARTICLES
1-) Real time exfoliation behavior of clay layers in epoxy-clay nanocompositesD Kong, CE ParkChemistry of materials 15 (2), 419-424, 20031462003
2-) Effect of curing temperature on the adhesion strength of polyamideimide/copper jointsJH Cho, DI Kong, CE Park, MY JinJournal of adhesion science and technology 12 (5), 507-521, 1998211998
3-) Effects of coupling agent thickness on residual stress in polyimide/-APS/silicon wafer j ointsDI Kong, CE Park, ST Hong, HC Yang, KT KimJournal of adhesion science and technology 13 (7), 805-818, 199951999
4-) Effects of coupling agent thickness on residual stress inCE Park, DI Kong, ST Hong, HC Yang, KT KimJournal of Adhesion Science and Technology(Netherlands) 13 (7), 805-818, 19991999