Xiaozhou Ye

Xiaozhou Ye

University of Queensland - St Lucia / Australia
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 5720112
The University of Queensland
person_outline Xiaozhou Ye's MOST POPULAR ARTICLES
1-) Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profileF Somidin, SD McDonald, X Ye, D Qu, K Sweatman, T Akaiwa, ...Transactions of The Japan Institute of Electronics Packaging 13, E19-004-1 …, 202072020
2-) The effect of strain rate on the ductility of bismuth-containing soldersK Sweatman, T Nishimura, S McDonald, X Ye, Q Hao, B Negura, XF Tan, ...SMTA International, 283, 202242022
3-) Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditionsF Somidin, SD McDonald, X Ye, D Qu, K Sweatman, T Akaiwa, ...2019 International Conference on Electronics Packaging (ICEP), 223-228, 201922019
4-) The Effects of Solution Treatment and Room Temperature Ageing on Mechanical Properties of Sn-37wt% Bi and Sn-57wt% BiX Ye, L Tao, SD McDonald, XF Tan, K Sweatman, K Nogita2023 International Conference on Electronics Packaging (ICEP), 215-216, 20232023
5-) Investigation of the Effects of Surface Finish and Reflow Conditions on the Microstructure and Mechanical Properties of Sn-based SoldersF Somidin, T Akaiwa, SD McDonald, T Nishimura, X Ye, A Smith, J Zhou, ...2022 International Conference on Electronics Packaging (ICEP), 177-178, 20222022