Andreas Munding

Andreas Munding

Infineon Technologies - - / Germany
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4443228
person_outline Andreas Munding's MOST POPULAR ARTICLES
1-) 3D chip stack technology using through-chip interconnects IEEE Design & Test of Computers 22 (6), 512-518, 2005
2-) Bi-stable micro actuator based on stress engineered nano-diamond Diamond and related materials 15 (4-8), 773-776, 2006
3-) Cu/Sn solid–liquid interdiffusion bonding Wafer Level 3-D ICs Process Technology, 1-39, 2008
4-) Three-dimensional integration scheme with a thermal budget below 300° C Sensors and Actuators A: Physical 139 (1-2), 350-355, 2007
5-) Bi-stable micro actuator based on stress engineered nano-diamond Diamond and related materials 15 (4-8), 773-776, 2006