Anna Topol

Anna Topol

IBM Corporation - New York / United States
Engineering & Technology / Nanoscience and Nanotechnology
AD Scientific Index ID: 4462837
person_outline Anna Topol's MOST POPULAR ARTICLES
1-) Three-dimensional integrated circuitsAW Topol, DC La Tulipe, L Shi, DJ Frank, K Bernstein, SE Steen, A Kumar, ...IBM Journal of Research and Development 50 (4.5), 491-506, 20068502006
2-) Stable SRAM cell design for the 32 nm node and beyondL Chang, DM Fried, J Hergenrother, JW Sleight, RH Dennard, ...Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005., 128-129, 20058112005
3-) Three-dimensional silicon integrationJU Knickerbocker, PS Andry, B Dang, RR Horton, MJ Interrante, CS Patel, ...IBM Journal of Research and Development 52 (6), 553-569, 20085302008
4-) High density chip carrier with integrated passive devicesMP Chudzik, RH Dennard, R Divakaruni, BK Furman, R Jammy, ...US Patent 7,030,481, 20063742006
5-) Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)AW Topol, DC La Tulipe, L Shi, SM Alam, DJ Frank, SE Steen, J Vichiconti, ...IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 20053612005