Anson Heryanto

Nanyang Technological University - Jurong West / Singapore

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AD Scientific Index ID: 6081079

南洋理工大学

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Anson Heryanto's MOST POPULAR ARTICLES

1-) Effect of copper TSV annealing on via protrusion for TSV wafer fabricationA Heryanto, WN Putra, A Trigg, S Gao, WS Kwon, FX Che, XF Ang, J Wei, ...Journal of electronic materials 41, 2533-2542, 20121842012

2-) Study on Cu protrusion of through-silicon viaFX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL GanIEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 20131052013

3-) The effect of stress migration on electromigration in dual damascene copper interconnectsA Heryanto, KL Pey, YK Lim, W Liu, N Raghavan, J Wei, CL Gan, MK Lim, ...Journal of Applied Physics 109 (1), 2011282011

4-) Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)FX Che, WN Putra, A Heryanto, A Trigg, S Gao, CL Gan2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE …, 2012172012

5-) Study of stress migration and electromigration interaction in copper/low-κ interconnectsA Heryanto, KL Pey, YK Lim, W Liu, J Wei, N Raghavan, JB Tan, DK Sohn2010 IEEE International Reliability Physics Symposium, 586-590, 2010152010

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