Arief S Budiman

Arief S Budiman

Singapore University of Technology and Design - Singapore / Singapore
Engineering & Technology / Mechanical Engineering
AD Scientific Index ID: 339132
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person_outline Arief S Budiman's MOST POPULAR ARTICLES
1-) Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuitsAS Budiman, HAS Shin, BJ Kim, SH Hwang, HY Son, MS Suh, QH Chung, ...Microelectronics Reliability 52 (3), 530-533, 20121402012
2-) The development of microstructure and the influence of processing route during equal channel angular drawing of pure aluminumU Chakkingal, AB Suriadi, PF ThomsonMaterials Science and Engineering: A 266 (1-2), 241-249, 19991331999
3-) Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffractionAS Budiman, WD Nix, N Tamura, BC Valek, K Gadre, J Maiz, R Spolenak, ...Applied Physics Letters 88 (23), 233515, 20061262006
4-) A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffractionAS Budiman, SM Han, JR Greer, N Tamura, JR Patel, WD NixActa Materialia 56 (3), 602-608, 20081132008
5-) Microstructure development during equal channel angular drawing of Al at room temperatureU Chakkingal, AB Suriadi, PF ThomsonScripta Materialia 39 (6), 677-684, 19981001998