Bernard Flechet

Bernard Flechet

Université de Savoie Mont Blanc - Chambéry / France
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4683488
person_outline Bernard Flechet's MOST POPULAR ARTICLES
1-) High frequency characterization and modeling of high density TSV in 3D integrated circuits C Bermond, L Cadix, A Farcy, T Lacrevaz, P Leduc, B Flechet 2009 IEEE Workshop on Signal Propagation on Interconnects, 1-4, 2009 822009
2-) Investigation on TSV impact on 65nm CMOS devices and circuits H Chaabouni, M Rousseau, P Leduc, A Farcy, R El Farhane, A Thuaire, ... 2010 International Electron Devices Meeting, 35.1. 1-35.1. 4, 2010 612010
3-) Modelling of through silicon via RF performance and impact on signal transmission in 3D integrated circuits L Cadix, A Farcy, C Bermond, C Fuchs, P Leduc, M Rousseau, M Assous, ... 2009 IEEE International Conference on 3D System Integration, 1-7, 2009 572009
4-) Performance analysis of four nonlinearity analysis methods using a model with variable complexity and application to uterine EMG signalsA Diab, M Hassan, C Marque, B KarlssonMedical engineering & physics 36 (6), 761-767, 2014432014
5-) RF characterization and modelling of high density through silicon vias for 3D chip stackingL Cadix, C Bermond, C Fuchs, A Farcy, P Leduc, L DiCioccio, M Assous, ...Microelectronic Engineering 87 (3), 491-495, 2010422010