Bite Zhou

Bite Zhou

Intel Corporation - California / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4377634
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person_outline Bite Zhou's MOST POPULAR ARTICLES
1-) The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder jointsTR Bieler, B Zhou, L Blair, A Zamiri, P Darbandi, F Pourboghrat, TK Lee, ...Journal of Electronic Materials 41 (2), 283-301, 20121092012
2-) Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging MicroscopyTK Lee, B Zhou, L Blair, KC Liu, TR BielerJournal of electronic materials, 1-10, 2010792010
3-) Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the InterfaceB Zhou, TR Bieler, T Lee, KC LiuJournal of electronic materials, 1-11, 2010682010
4-) Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple ShearB Zhou, TR Bieler, TK Lee, KC LiuJournal of electronic materials 38 (12), 2702-2711, 2009662009
5-) Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solderS Mukherjee, B Zhou, A Dasgupta, TR Bielerinternational Journal of Plasticity 78, 1-25, 2016572016