Boris Vaisband

Boris Vaisband

McGill University - Montréal / Canada
Others
AD Scientific Index ID: 5933113
person_outline Boris Vaisband's MOST POPULAR ARTICLES
1-) Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systemsSS Iyer, S Jangam, B VaisbandIBM Journal of Research and Development 63 (6), 5: 1-5: 16, 2019372019
2-) Hexagonal TSV Bundle Topology for 3-D ICsB Vaisband, EG FriedmanIEEE Transactions on Circuits and Systems II: Express Briefs 64 (1), 11-15, 2017232017
3-) Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) AssemblyAA Bajwa, SC Jangam, S Pal, B Vaisband, R Irwin, M Goorsky, SS Iyer2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1926-1930, 2018222018
4-) Process Development of Power Delivery Through Wafer Vias for Silicon Interconnect FabricMH Liu, B Vaisband, A Hanna, Y Luo, Z Wan, SS Iyer2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 579-586, 2019202019
5-) 3-D ICs as a Platform for Heterogeneous Systems IntegrationB VaisbandUniversity of Rochester, 2017192017