Chandrasekharan Nair

Chandrasekharan Nair

Intel Corporation - California / United States
Others
AD Scientific Index ID: 4891735
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person_outline Chandrasekharan Nair's MOST POPULAR ARTICLES
1-) Design and demonstration of a 2.5-D glass interposer BGA package for high bandwidth and low cost IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017
2-) A review of low-temperature solders in microelectronics packaging IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023
3-) Next generation panel-scale RDL with ultra small photo vias and ultra-fine embedded trenches for low cost 2.5 D interposers and high density fan-out WLPs 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1515-1521, 2016
4-) Effect of ultra-fine pitch RDL process variations on the electrical performance of 2.5 D glass interposers up to 110 GHz 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2408-2413, 2016
5-) “zero-undercut” semi-additive copper patterning-a breakthrough for ultrafine-line RDL lithographic structures and precision RF thinfilm passivesPM Raj, C Nair, H Lu, F Liu, V Sundaram, DW Hess, R Tummala2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 402-405, 2015