Chao-Kun Hu

Chao-Kun Hu

IBM Corporation - New York / United States
Others
AD Scientific Index ID: 4463071
person_outline Chao-Kun Hu's MOST POPULAR ARTICLES
1-) Copper metallization for high performance silicon technologyR Rosenberg, DC Edelstein, CK Hu, KP RodbellAnnual Review of Materials Research 30, 229, 20005512000
2-) Mechanisms for microstructure evolution in electroplated copper thin films near room temperatureJME Harper, C Cabral Jr, PC Andricacos, L Gignac, IC Noyan, KP Rodbell, ...Journal of applied physics 86 (5), 2516-2525, 19994411999
3-) Electromigration path in Cu thin-film linesCK Hu, R Rosenberg, KY LeeApplied Physics Letters 74 (20), 2945-2947, 19994181999
4-) Reduced electromigration and stressed induced migration of Cu wires by surface coatingCK Hu, R Rosenberg, JM Rubino, CJ Sambucetti, AK StamperUS Patent 6,342,733, 20024092002
5-) Copper interconnections and reliabilityCK Hu, JME HarperMaterials Chemistry and Physics 52 (1), 5-16, 19983901998