Chi-Nung Ni

Chi-Nung Ni

Applied Materials, Inc. - / United States
Engineering & Technology / Computer Science
AD Scientific Index ID: 4482592
person_outline Chi-Nung Ni's MOST POPULAR ARTICLES
1-) HKMG process impact on N, P BTI: Role of thermal IL scaling, IL/HK integration and post HK nitridationK Joshi, S Hung, S Mukhopadhyay, V Chaudhary, N Nanaware, ...2013 IEEE International Reliability Physics Symposium (IRPS), 4C. 2.1-4C. 2.10, 2013602013
2-) Ultra-low contact resistivity with highly doped Si: P contact for nMOSFETCN Ni, X Li, S Sharma, KV Rao, M Jin, C Lazik, V Banthia, B Colombeau, ...2015 Symposium on VLSI Technology (VLSI Technology), T118-T119, 2015432015
3-) Ultra-low NMOS contact resistivity using a novel plasma-based DSS implant and laser anneal for post 7 nm nodesCN Ni, KV Rao, F Khaja, S Sharma, S Tang, JJ Chen, KE Hollar, N Breil, ...2016 IEEE Symposium on VLSI Technology, 1-2, 2016342016
4-) Fin doping by hot implant for 14nm FinFET technology and beyondBS Wood, FA Khaja, BP Colombeau, S Sun, A Waite, M Jin, H Chen, ...ECS Transactions 58 (9), 249, 2013352013
5-) Ultra low p-type SiGe contact resistance FinFETs with Ti silicide liner using cryogenic contact implantation amorphization and solid-phase epitaxial regrowth (SPER)YR Yang, N Breil, CY Yang, J Hsieh, F Chiang, B Colombeau, BN Guo, ...2016 IEEE Symposium on VLSI Technology, 1-2, 2016272016