Chia-Ling Pai

Chia-Ling Pai

Applied Materials, Inc. - Santa Clara / United States
Engineering & Technology / Chemical Engineering
AD Scientific Index ID: 4403051
person_outline Chia-Ling Pai's MOST POPULAR ARTICLES
1-) Morphology of porous and wrinkled fibers of polystyrene electrospun from dimethylformamideCL Pai, MC Boyce, GC RutledgeMacromolecules 42 (6), 2102-2114, 20092802009
2-) Spin coating of conjugated polymers for electronic and optoelectronic applicationsCC Chang, CL Pai, WC Chen, SA JenekheThin solid films 479 (1-2), 254-260, 20051662005
3-) Mechanical properties of individual electrospun PA 6 (3) T fibers and their variation with fiber diameterCL Pai, MC Boyce, GC RutledgePolymer 52 (10), 2295-2301, 20111382011
4-) Wrinkled surface topographies of electrospun polymer fibersL Wang, CL Pai, MC Boyce, GC RutledgeApplied Physics Letters 94 (15), 20091362009
5-) Elastic–plastic behavior of non-woven fibrous matsMN Silberstein, CL Pai, GC Rutledge, MC BoyceJournal of the Mechanics and Physics of Solids 60 (2), 295-318, 20121272012