Cong Zhao

Cong Zhao

Auburn University - Auburn / United States
Others
AD Scientific Index ID: 4695140
person_outline Cong Zhao's MOST POPULAR ARTICLES
1-) Long Term Aging Effects on The Reliability of Lead Free Solder Joints in Ball Grid Array Packages With Various Pitch Sizes and Ball ArrangementJE Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, MJ BozackJournal of Surface Mount Technology 29 (2), 37-46, 201663*2016
2-) Effect of surface finish and high bi solder alloy on component reliability in thermal cyclingF Akkara, M Abueed, M Rababah, C Zhao, S Su, J Suhling, J Evans2018 IEEE 68th electronic components and technology conference (ECTC), 2032-2040, 2018372018
3-) Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cyclingC Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC SuhlingMaterials 10 (5), 451, 2017292017
4-) Effect of solder sphere alloys and surface finishes on the reliability of lead-free solder joints in accelerated thermal cyclingFJ Akkara, C Zhao, R Athamenh, S Su, M Abueed, S Hamasha, J Suhling, ...2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018282018
5-) Board level reliability of lead-free solder interconnections with solder doping under harsh environmentC ZhaoAuburn University, 2017172017