Daniel Josell

Daniel Josell

National Institute of Standards and Technology - Maryland / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4393701
person_outline Daniel Josell's MOST POPULAR ARTICLES
1-) Superconformal electrodeposition of copper in 500–90 nm featuresTP Moffat, JE Bonevich, WH Huber, A Stanishevsky, DR Kelly, GR Stafford, ...Journal of The Electrochemical Society 147 (12), 4524, 20005562000
2-) Superconformal film growth: Mechanism and quantificationTP Moffat, D Wheeler, MD Edelstein, D JosellIBM Journal of Research and Development 49 (1), 19-36, 20054382005
3-) Superconformal electrodeposition of copperTP Moffat, D Wheeler, WH Huber, D JosellElectrochemical and Solid-State Letters 4 (4), C26, 20014182001
4-) Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPSTP Moffat, D Wheeler, D JosellJournal of The Electrochemical Society 151 (4), C262, 20044152004
5-) Size-dependent resistivity in nanoscale interconnectsD Josell, SH Brongersma, Z TőkeiAnnual Review of Materials Research 39 (1), 231-254, 20093222009