Daniel L Blass

Daniel L Blass

Binghamton University - Vestal / United States
Others
AD Scientific Index ID: 5565966
State University of New York at Binghamton
person_outline Daniel L Blass's MOST POPULAR ARTICLES
1-) Nanocopper based solder-free electronic assemblyK Schnabl, L Wentlent, K Mootoo, S Khasawneh, AA Zinn, J Beddow, ...Journal of Electronic Materials 43, 4515-4521, 2014412014
2-) Flip chip reliabilityP Borgesen, D Blass, K SrihariUniversal Instruments, 1-9, 2001142001
3-) Optimizing flip chip substrate layout for assemblyP Kondos, P Borgesen, D Blass, A PratsProc. High Density Interconnect, 617-629, 2000142000
4-) Accelerated testing of flip chip underfills and the effect of moisture and temperature on the aging of underfillsR Chaware, N Vichare, P Borgesen, D Blass, K SrihariProceedings of 2004 Surface Mount Technology Association International, 374-380, 2004132004
5-) Effects of corner/edge bonding and underfill properties on the thermal cycling performance of lead free ball grid array assembliesP Borgesen, D Blass, M Meilunas112012