Desmond Yr Chong

Desmond Yr Chong

Singapore Institute of Technology - Dover / Singapore
Engineering & Technology / Mechanical Engineering
AD Scientific Index ID: 339125
Institut Teknologi Singapura
person_outline Desmond Yr Chong's MOST POPULAR ARTICLES
1-) Drop impact reliability testing for lead-free and lead-based soldered IC packages Microelectronics reliability 46 (7), 1160-1171, 2006
2-) Thermal cycling analysis of flip-chip solder joint reliability IEEE Transactions on components and packaging technologies 24 (4), 705-712, 2002
3-) Analysis of bone–prosthesis interface micromotion for cementless tibial prosthesis fixation and the influence of loading conditions Journal of biomechanics 43 (6), 1074-1080, 2010
4-) Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models IEEE Transactions on Advanced Packaging 24 (4), 499-506, 2001
5-) Mechanical characterization in failure strength of silicon dice The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2004