Dionysios Manessis

Dionysios Manessis

Technische Universität Berlin - Berlin / Germany
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 1765184
Technical University of Berlin TU Berlin
person_outline Dionysios Manessis's MOST POPULAR ARTICLES
1-) Technical challenges of stencil printing technology for ultra fine pitch flip chip bumpingD Manessis, R Patzelt, A Ostmann, R Aschenbrenner, H ReichlMicroelectronics reliability 44 (5), 797-803, 2004772004
2-) Embedding of chips for system in package realization-technology and applicationsL Boettcher, D Manessis, A Ostmann, S Karaszkiewicz, H Reichl2008 3rd International Microsystems, Packaging, Assembly & Circuits …, 2008652008
3-) Effects of Co addition in eutectic Sn–3.5 Ag solder on shear strength and microstructural developmentJS Lee, KM Chu, R Patzelt, D Manessis, A Ostmann, DY JeonMicroelectronic Engineering 85 (7), 1577-1583, 2008482008
4-) Engineer the channel and adapt to it: Enabling wireless intra-chip communicationX Timoneda, S Abadal, A Franques, D Manessis, J Zhou, J Torrellas, ...IEEE Transactions on Communications 68 (5), 3247-3258, 2020472020
5-) Technical understanding of resin-coated-copper (RCC) lamination processes for realization of reliable chip embedding technologiesD Manessis, SF Yen, A Ostmann, R Aschenbrenner, H Reichl2007 Proceedings 57th Electronic Components and Technology Conference, 278-285, 2007422007