Dipali Sonawane

Dipali Sonawane

Max-Planck-Institut für Eisenforschung GmbH - Beijing / Germany
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 5622493
Max Planck Institute for Iron Research GmbH
person_outline Dipali Sonawane's MOST POPULAR ARTICLES
1-) Effect of strain rate and filler size on mechanical behavior of a Cu filled elastomer based compositeS Oberoi, D Sonawane, P KumarComposites Science and Technology 127, 185-192, 2016152016
2-) New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealingD Sonawane, P KumarEngineering Fracture Mechanics 238, 107281, 2020122020
3-) New insights into dewetting of Cu thin films deposited on SiD Sonawane, A Choudhury, P KumarLangmuir 36 (20), 5534-5545, 2020122020
4-) Role of grain boundary sliding in structural integrity of Cu-filled through Si via during isothermal annealingD Sonawane, P KumarJournal of Electronic Materials 50 (3), 767-778, 202162021
5-) Stability of Cu-islands formed on Si substrate via ‘dewetting’under subsequent thermal cyclingD Sonawane, P KumarNanotechnology 32 (19), 195703, 202162021