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Dong An
North University of China - Taiyuan / China
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AD Scientific Index ID: 4346065
中北大学
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Dong An's MOST POPULAR ARTICLES
1-)
A polymer-based thermal management material with enhanced thermal conductivity by introducing three-dimensional networks and covalent bond connectionsD An, S Cheng, Z Zhang, C Jiang, H Fang, J Li, Y Liu, CP WongCarbon 155, 258-267, 2019692019
2-)
Flexible thermal interfacial materials with covalent bond connections for improving high thermal conductivityD An, S Cheng, S Xi, Z Zhang, X Duan, Y Ren, J Li, Z Sun, Y Liu, ...Chemical Engineering Journal 383, 123151, 2020612020
3-)
Enhanced thermal conductivity of natural rubber based thermal interfacial materials by constructing covalent bonds and three-dimensional networksD An, X Duan, S Cheng, Z Zhang, B Yang, Q Lian, J Li, Z Sun, Y Liu, ...Composites Part A: Applied Science and Manufacturing 135, 105928, 2020432020
4-)
Modulation of covalent bonded boron nitride/graphene and three-dimensional networks to achieve highly thermal conductivity for polymer-based thermal interfacial materialsD An, Z Li, H Chen, C Liang, Z Sun, J Li, J Yao, Y Liu, C WongComposites Part A: Applied Science and Manufacturing 156, 106890, 2022462022
5-)
Preparation of a natural rubber with high thermal conductivity, low heat generation and strong interfacial interaction by using NS-modified graphene oxideS Cheng, X Duan, Z Zhang, D An, G Zhao, Y LiuJournal of Materials Science 56, 4034-4050, 2021402021
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