NEWS
New Feature!!!! University Subject Rankings in 12 branches
FOR SCIENTIST REGISTRATION FOR INSTITUTIONAL BULK REGISTRATION
FOR EDIT YOUR UNIVERSITY / INSTITUTION PAGE
Some differences of the AD Scientific Index
New Feature!!!! University Subject Rankings in 12 branches
List without CERN, Statistical Data etc. Only in AD Scientific Index
New Feature!!!! University Subject Rankings in 12 branches
AD
Scientific Index 2024
About Us
Methodology
Compare & Choose
Contact - FAQ
login
Login
person_add
Register
school
University Rankings
subject
University Subject Rankings
place
Country Rankings
insights
i10 Productivity Rankings
insights
Subject Rankings
format_list_numbered
Top 100 Scientists
format_list_numbered
Citation Rankings
format_quote
Top 100 Institutions
local_fire_department
Country Top Lists
Eric Beyne
AD Scientific Index 2024
Engineering & Technology / Electrical & Electronic Engineering
Interuniversity Microelectronics Centre - / Belgium
Edit Form
Registration, Add Profile,
Premium Membership
Ranking &
Analysis
Job
Experiences (0)
Education
Information (0)
Published Books (0)
Book Chapters (0)
Articles (0)
Presentations (0)
Lessons (0)
Projects (0)
Congresses (0)
Editorship, Referee &
Scientific Board (0 )
Patents /
Designs (0)
Academic Grants
& Awards (0)
Artistic
Activities (0)
Certificate / Course
/ Trainings (0)
Association &
Society Memberships (0)
Contact, Office
& Social Media
person_outline
Eric Beyne's MOST POPULAR ARTICLES
1-)
Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ... IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010 3812010
2-)
Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film deviceE Beyne, A Coello-Vera, O VendierUS Patent 6,730,997, 20043122004
3-)
Method of fabrication of a microstructure having an internal cavityHAC Tilmans, E Beyne, M Van de PeerUS Patent 6,297,072, 20013122001
4-)
MEMS for wireless communications:‘from RF-MEMS components to RF-MEMS-SiP’HAC Tilmans, W De Raedt, E BeyneJournal of Micromechanics and Microengineering 13 (4), S139, 20033062003
5-)
3-D technology assessment: Path-finding the technology/design sweet-spotP Marchal, B Bougard, G Katti, M Stucchi, W Dehaene, A Papanikolaou, ...Proceedings of the IEEE 97 (1), 96-107, 20092852009
ARTICLES
Add your articles
We use cookies to personalize our website and offer you a better experience. If you accept cookies, we can offer you special services.
Cookie Policy
Accept