Faxing Che

Faxing Che

Micron Technology Inc - - / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4522987
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person_outline Faxing Che's MOST POPULAR ARTICLES
1-) Drop impact reliability testing for lead-free and lead-based soldered IC packagesDYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH LowMicroelectronics Reliability 46 (7), 1160-1171, 20062092006
2-) Effect of copper TSV annealing on via protrusion for TSV wafer fabricationA Heryanto, WN Putra, A Trigg, S Gao, WS Kwon, FX Che, XF Ang, J Wei, ...Journal of electronic materials 41, 2533-2542, 20121632012
3-) The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperaturesFX Che, WH Zhu, ESW Poh, XW Zhang, XR ZhangJournal of Alloys and Compounds 507 (1), 215-224, 20101612010
4-) Vibration reliability test and finite element analysis for flip chip solder jointsFX Che, JHL PangMicroelectronics reliability 49 (7), 754-760, 20091402009
5-) Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliabilityL Xu, JHL Pang, F CheJournal of Electronic Materials 37, 880-886, 20081302008