Fei Chong Ng

Universiti Sains Malaysia - Penang / Malaysia

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AD Scientific Index ID: 6084923

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Fei Chong Ng's MOST POPULAR ARTICLES

1-) Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid arrayFC Ng, A Abas, MHH Ishak, MZ Abdullah, A AzizMicroelectronics Reliability 66, 143-160, 2016

2-) Underfill flow in flip-chip encapsulation process: a reviewFC Ng, MA AbasJournal of Electronic Packaging 144 (1), 010803, 2022

3-) Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approachesFC Ng, A Abas, MZ AbdullahMicroelectronics Reliability 81, 41-63, 2018

4-) Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadingsFC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT AliMicroelectronics Reliability 72, 45-64, 2017

5-) Numerical study of composite fiberglass cross arms under statics loading and improvement with sleeve installationD Mohamad, A Syamsir, S Beddu, A Abas, FC Ng, MF Razali, S SemanIOP Conference Series: Materials Science and Engineering 530 (1), 012027, 2019272019

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