Feng Li

University of Idaho - Moscow / United States

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AD Scientific Index ID: 5665275

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Feng Li's MOST POPULAR ARTICLES

1-) Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling testsY Zhang, K Wu, H Li, S Shen, W Cao, F Li, J HanMicroelectronics Reliability 139, 114829, 2022132022

2-) Scaling Beyond 7nm Node: An Overview of Gate-All-Around FETsW Hu, F Li2021 9th International Symposium on Next Generation Electronics (ISNE), 1-6, 2021162021

3-) Investigation of potting-adhesive-induced thermal stress in MEMS pressure sensorY Zhang, B Li, H Li, S Shen, F Li, W Ni, W CaoSensors 21 (6), 2011, 2021152021

4-) Trench gate β-Ga2O3 MOSFETs: A reviewX Chen, F Li, HL HessEngineering Research Express 5 (1), 012004, 2023

5-) 3D Stacking of SiC Integrated Circuit Chips with Gold Wire Bonded Interconnects for Long-Duration High-Temperature ApplicationsF LiIEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 202282022

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