Fengze Hou

Fengze Hou

Delft University of Technology - Delft / Netherlands
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4347875
Technische Universiteit Delft
person_outline Fengze Hou's MOST POPULAR ARTICLES
1-) Review of packaging schemes for power moduleF Hou, W Wang, L Cao, J Li, M Su, T Lin, G Zhang, B FerreiraIEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 223-238, 2019632019
2-) Experimental verification and optimization analysis of warpage for panel-level fan-out packageF Hou, T Lin, L Cao, F Liu, J Li, X Fan, GQ ZhangIEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017422017
3-) Fan-out panel-level PCB-embedded SiC power MOSFETs packagingF Hou, W Wang, R Ma, Y Li, Z Han, M Su, J Li, Z Yu, Y Song, Q Wang, ...IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 367-380, 2019312019
4-) Thermal analysis of LED lighting system with different fin heat sinksF Hou, D Yang, G ZhangJournal of Semiconductors 32 (1), 014006, 2011302011
5-) Characterization of PCB embedded package materials for SiC MOSFETsF Hou, W Wang, T Lin, L Cao, GQ Zhang, JA FerreiraIEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019282019