Fuhan Liu

Fuhan Liu

Georgia Institute of Technology - Atlanta / United States
Others
AD Scientific Index ID: 1360194
person_outline Fuhan Liu's MOST POPULAR ARTICLES
1-) The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decadeRR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...IEEE Transactions on Advanced Packaging 27 (2), 250-267, 20041832004
2-) Through-package-via formation and metallization of glass interposersV Sukumaran, Q Chen, F Liu, N Kumbhat, T Bandyopadhyay, H Chan, ...2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 20101362010
3-) Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-viasV Sukumaran, T Bandyopadhyay, Q Chen, N Kumbhat, F Liu, R Pucha, ...2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 583-588, 2011942011
4-) Through-package-via (TPV) structures on inorganic interposer and methods for fabricating sameV Sundaram, F Liu, R Tummala, V Sukumaran, V Sridharan, Q ChenUS Patent 9,275,934, 2016822016
5-) Chip-last embedded interconnect structuresF Liu, N Kumbhat, V Sundaram, RR TummalaUS Patent 8,536,695, 2013822013