Gonella

Gonella

STMicroelectronics Pvt Ltd - Geneva / France
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4451270
person_outline Gonella's MOST POPULAR ARTICLES
1-) Key reliability issues for copper integration in damascene architectureR GonellaMicroelectronic engineering 55 (1-4), 245-255, 2001672001
2-) Integrated circuit connecting padM Varrot, G Bouche, R Gonella, E SabouretUS Patent 6,822,329, 2004662004
3-) Electromigration failure modes in damascene copper interconnectsL Arnaud, R Gonella, G Tartavel, J Torres, C Gounelle, Y Gobil, Y MorandMicroelectronics Reliability 38 (6-8), 1029-1034, 1998311998
4-) Cu/SiO2 hybrid bonding: Finite element modeling and experimental characterizationC Sart, R Estevez, V Fiori, S Lhostis, E Deloffre, G Parry, R Gonella2016 6th Electronic System-Integration Technology Conference (ESTC), 1-7, 2016312016
5-) Children\'s co-design and inclusive educationF Garzotto, R GonellaProceedings of the 10th international conference on interaction design and …, 2011312011