Hai Jun Cho

Hai Jun Cho

Hokkaido University - Sapporo / Japan
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4467039
北海道大学
person_outline Hai Jun Cho's MOST POPULAR ARTICLES
1-) Thermal conductivity of copper-diamond composite materials produced by electrodeposition and the effect of TiC coatings on diamond particlesHJ Cho, YJ Kim, U ErbComposites Part B: Engineering 155, 197-203, 2018482018
2-) Effects of diamond particle size on the formation of copper matrix and the thermal transport properties in electrodeposited copper-diamond composite materialsHJ Cho, D Yan, J Tam, U ErbJournal of Alloys and Compounds 791, 1128-1137, 2019522019
3-) Effects of vacuum annealing on the electron mobility of epitaxial La-doped BaSnO3 filmsHJ Cho, T Onozato, M Wei, A Sanchela, H OhtaAPL materials 7 (2), 2019522019
4-) High electrical conducting deep-ultraviolet-transparent oxide semiconductor La-doped SrSnO3 exceeding∼ 3000 S cm− 1M Wei, AV Sanchela, B Feng, Y Ikuhara, HJ Cho, H OhtaApplied physics letters 116 (2), 2020462020
5-) Microstructural and bulk properties evolution of cold-sprayed copper coatings after low temperature annealingB Yu, J Tam, W Li, HJ Cho, JG Legoux, D Poirier, JD Giallonardo, U ErbMaterialia 7, 100356, 2019382019