Hari Krishna Kanagala

University of Chicago Booth School of Business - Chicago / United States

Engineering & Technology / Mechanical Engineering

AD Scientific Index ID: 5448509

Chicago Booth

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Hari Krishna Kanagala's MOST POPULAR ARTICLES

1-) Modeling of Particle Agglomeration in NanofluidsKH Krishna, S Neti, A Oztekin, S MohapatraJournal of Applied Physics 117, 8, 2015372015

2-) Pool Boiling Characteristics of Metallic NanofluidsKH Krishna, H Ganapathy, G Satish, SK DasJournal of Heat Transfer 133 (11), 8, 2011282011

3-) Modeling of particle agglomeration in nanofluidsHK KanagalaLehigh University, 201362013

4-) Heat Exchange Tubes And Tube Assembly ConfigurationsHK Kanagala, K Frederick, D BinzUS Patent US10415892B2, 201952019

5-) Heat exchanger tube with finsHK Kanagala, K Frederick, D BinzUS Patent USD960336S1, 202222022

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