Henghua Jin

Henghua Jin

University of Illinois Urbana Champaign - Champaign / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 1386849
person_outline Henghua Jin's MOST POPULAR ARTICLES
1-) Self-healing thermoset using encapsulated epoxy-amine healing chemistryH Jin, CL Mangun, DS Stradley, JS Moore, NR Sottos, SR WhitePolymer 53 (2), 581-587, 20123562012
2-) Robust, double-walled microcapsules for self-healing polymeric materialsMM Caruso, BJ Blaiszik, H Jin, SR Schelkopf, DS Stradley, NR Sottos, ...ACS applied materials & interfaces 2 (4), 1195-1199, 20102282010
3-) Thermally stable autonomic healing in epoxy using a dual‐microcapsule systemH Jin, CL Mangun, AS Griffin, JS Moore, NR Sottos, SR WhiteAdvanced materials 26 (2), 282-287, 20142052014
4-) Fracture and fatigue response of a self-healing epoxy adhesiveH Jin, GM Miller, NR Sottos, SR WhitePolymer 52 (7), 1628-1634, 20111642011
5-) Fracture behavior of a self-healing, toughened epoxy adhesiveH Jin, GM Miller, SJ Pety, AS Griffin, DS Stradley, D Roach, NR Sottos, ...International Journal of Adhesion and Adhesives 44, 157-165, 20131272013