Henning Braunisch

Henning Braunisch

Intel Corporation - California / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4376745
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person_outline Henning Braunisch's MOST POPULAR ARTICLES
1-) Multi-chip package and method of providing die-to-die interconnects in same US Patent 8,227,904, 2012
2-) Methods and apparatus to mount a waveguide to a substrate US Patent 7,684,660, 2010
3-) Bumpless build-up layer packagingSN Towle, H Braunisch, C Hu, RD EmeryASME Intl. Mech. Eng. Digest, 2001137*2001
4-) Effects of random rough surface on absorption by conductors at microwave frequenciesL Tsang, X Gu, H BraunischIEEE microwave and wireless components letters 16 (4), 221-223, 20061162006
5-) Methods and apparatus to mount a waveguide to a substrateH Braunisch, D Lu, N ArbizuUS Patent 7,684,660, 20101152010