Hongbin Shi

Hongbin Shi

Huawei Technologies - Shenzhen / China
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4721886
华为技术
person_outline Hongbin Shi's MOST POPULAR ARTICLES
1-) Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bendingH Shi, F Che, T UedaMicroelectronics Reliability 51 (9-11), 1850-1855, 2011262011
2-) Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methodsH Shi, FX Che, C Tian, R Zhang, JT Park, T UedaMicroelectronics Reliability 52 (9-10), 1870-1875, 2012202012
3-) Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear testH Shi, T UedaMicroelectronics Reliability 51 (9-11), 1898-1902, 2011192011
4-) Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assembliesH Shi, T UedaProceedings of the 3rd International Conference on Computer Research and …, 2011132011
5-) Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic productsH Shi, T Ueda2011 12th International Conference on Electronic Packaging Technology and …, 2011122011