Hongjun Ji

Harbin Institute of Technology - Harbin / China

Others

AD Scientific Index ID: 750291

哈尔滨技术学院

Registration, Add Profile,
Premium Membership

Print Your Certificate

Hongjun Ji's MOST POPULAR ARTICLES

1-) Highly conductive Cu–Cu joint formation by low-temperature sintering of formic acid-treated Cu nanoparticlesJ Liu, H Chen, H Ji, M LiACS applied materials & interfaces 8 (48), 33289-33298, 20161842016

2-) Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packagingS Wang, M Li, H Ji, C WangScripta Materialia 69 (11-12), 789-792, 20131812013

3-) Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during solderingM Yang, H Ji, S Wang, YH Ko, CW Lee, J Wu, M LiJournal of Alloys and Compounds 679, 18-25, 20161122016

4-) Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7 Cu solder for high temperature packaging applicationH Ji, Y Qiao, M LiScripta Materialia 110, 19-23, 20161112016

5-) Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metalY Xiao, H Ji, M Li, J KimMaterials & Design (1980-2015) 52, 740-747, 2013982013

ARTICLES

Add your articles