Ht Hung

National Taiwan University - Taipei / Taiwan

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AD Scientific Index ID: 6086406

國立台灣大學

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Ht Hung's MOST POPULAR ARTICLES

1-) Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materialsCC Li, F Drymiotis, LL Liao, HT Hung, JH Ke, CK Liu, CR Kao, GJ SnyderJournal of Materials Chemistry C 3 (40), 10590-10596, 2015432015

2-) Chip-to-chip direct interconnections by using controlled flow electroless ni platingHT Hung, S Yang, YB Chen, CR KaoJournal of electronic materials 46, 4321-4325, 2017

3-) Materials merging mechanism of microfluidic electroless interconnection processS Yang, HT Hung, PY Wu, YW Wang, H Nishikawa, CR KaoJournal of The Electrochemical Society 165 (7), D273, 2018

4-) Highly uniform microfluidic electroless interconnections for chip stacking applicationsHT Hung, ZD Ma, PS Shih, JH Huang, LY Kao, CY Yang, V Renganathan, ...Electrochimica Acta 376, 138032, 2021242021

5-) Phase formation and microstructure evolution in Cu/In/Cu jointsYS Chiu, HY Yu, HT Hung, YW Wang, CR KaoMicroelectronics Reliability 95, 18-27, 2019222019

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