Hua Bai

Hua Bai

Ningbo Institute of Material Technology and Engineering - Ningbo / China
Others
AD Scientific Index ID: 4572233
宁波材料技术与工程研究所
person_outline Hua Bai's MOST POPULAR ARTICLES
1-) Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powderH Bai, N Ma, J Lang, C Zhu, Y MaComposites Part B: Engineering 52, 182-186, 2013722013
2-) Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond compositesH Bai, N Ma, J Lang, C ZhuJournal of alloys and compounds 580, 382-385, 2013562013
3-) Thermo-physical properties of boron carbide reinforced copper composites fabricated by electroless deposition processH Bai, N Ma, J Lang, Y Jin, C Zhu, Y MaMaterials & Design (1980-2015) 46, 740-745, 2013352013
4-) Thermal properties of Si (Al)/diamond composites prepared by in situ reactive sinteringC Zhu, N Ma, Y Jin, H Bai, Y Ma, J LangMaterials & Design 41, 208-213, 2012232012
5-) Architecting boron nanostructure on the diamond particle surfaceH Bai, D Dai, JH Yu, K Nishimura, S Sasaoka, N JiangApplied surface science 292, 790-794, 2014152014