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Hua Lu
University of Greenwich - London / United Kingdom
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AD Scientific Index ID: 1604964
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Hua Lu's MOST POPULAR ARTICLES
1-)
Design for reliability of power electronics modulesH Lu, C Bailey, C YinMicroelectronics reliability 49 (9-11), 1250-1255, 20092222009
2-)
Failure and reliability analysis of a SiC power module based on stress comparison to a Si deviceB Hu, JO Gonzalez, L Ran, H Ren, Z Zeng, W Lai, B Gao, O Alatise, H Lu, ...IEEE Transactions on device and materials reliability 17 (4), 727-737, 20171622017
3-)
A multi-scale atomistic-continuum modelling of crack propagation in a two-dimensional macroscopic plateH Rafii-Tabar, L Hua, M CrossJournal of Physics: Condensed Matter 10 (11), 2375, 19981621998
4-)
Effect of adding 1 wt% Bi into the Sn–2.8 Ag–0.5 Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal agingMJ Rizvi, YC Chan, C Bailey, H Lu, MN IslamJournal of Alloys and Compounds 407 (1-2), 208-214, 20061132006
5-)
Wire bond reliability for power electronic modules-effect of bonding temperatureWS Loh, M Corfield, H Lu, S Hogg, T Tilford, CM Johnson2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007772007
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