Hyoung Joon Kim

Hyoung Joon Kim

Qualcomm Inc - San Diego / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4396820
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person_outline Hyoung Joon Kim's MOST POPULAR ARTICLES
1-) Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondabilityHJ Kim, JY Lee, KW Paik, KW Koh, J Won, S Choe, J Lee, JT Moon, ...IEEE Transactions on Components and Packaging Technologies 26 (2), 367-374, 20032692003
2-) Fan-out semiconductor package and manufacturing method thereofDH Lee, KS Oh, JR Kim, HJ KimUS Patent 10,566,289, 2020482020
3-) Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliabilitySA Gam, HJ Kim, JS Cho, YJ Park, JT Moon, KW PaikJournal of Electronic materials 35, 2048-2055, 2006452006
4-) Ultrasonic anisotropic conductive films (ACFs) bonding of flexible substrates on organic rigid boards at room temperatureK Lee, HJ Kim, I Kim, KW Paik2007 Proceedings 57th Electronic Components and Technology Conference, 480-486, 2007352007
5-) Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bondingA Pequegnat, HJ Kim, M Mayer, Y Zhou, J Persic, JT MoonMicroelectronics Reliability 51 (1), 43-52, 2011312011