Hyunseop Lee

Hyunseop Lee

Tongmyong University - Busan / South Korea
Engineering & Technology / Mechanical Engineering
AD Scientific Index ID: 364254
동명대학교
person_outline Hyunseop Lee's MOST POPULAR ARTICLES
1-) Mechanical aspects of the chemical mechanical polishing process: A reviewH Lee, D Lee, H JeongInternational journal of precision engineering and manufacturing 17, 525-536, 20161112016
2-) Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processesHS Lee, HD Jeong, DA DornfeldPrecision Engineering 37 (2), 483-490, 20131112013
3-) Slurry components in metal chemical mechanical planarization (CMP) process: A reviewD Lee, H Lee, H JeongInternational Journal of Precision Engineering and Manufacturing 17, 1751-1762, 20161122016
4-) Chemical and mechanical balance in polishing of electronic materials for defect-free surfacesHS Lee, HD JeongCIRP annals 58 (1), 485-490, 20091122009
5-) Hybrid polishing mechanism of single crystal SiC using mixed abrasive slurry (MAS)HS Lee, DI Kim, JH An, HJ Lee, KH Kim, H JeongCIRP annals 59 (1), 333-336, 20101052010