Imedsl

Imedsl

National Chung Cheng University - Minxiong / Taiwan
Others
AD Scientific Index ID: 338366
國立中正大學
person_outline Imedsl's MOST POPULAR ARTICLES
1-) Failure mode analysis of lead-free solder joints under high speed impact testingDS Liu, CY Kuo, CL Hsu, GS Shen, YR Chen, KC LoMaterials Science and Engineering: A 494 (1-2), 196-202, 2008822008
2-) Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element methodDS Liu, YC Chao, CH WangFinite Elements in Analysis and Design 40 (3), 263-286, 2004752004
3-) Influence of environmental factors on energy absorption degradation of polystyrene foam in protective helmetsDS Liu, CY Chang, CM Fan, SL HsuEngineering Failure Analysis 10 (5), 581-591, 2003562003
4-) Effects of dopant, temperature, and strain rate on the mechanical properties of micrometer gold-bonding wireDS Liu, YC ChaoJournal of electronic materials 32, 159-165, 2003462003
5-) A coupled IEM/FEM approach for solving elastic problems with multiple cracksDS Liu, DY ChiouInternational Journal of Solids and Structures 40 (8), 1973-1993, 2003332003