Iuliana Panchenko|Iuliana Panchenko

Iuliana Panchenko|Iuliana Panchenko

Technische Universität Dresden - Dresden / Germany
Engineering & Technology / Nanoscience and Nanotechnology
AD Scientific Index ID: 4562295
Dresden University of Technology
person_outline Iuliana Panchenko|Iuliana Panchenko's MOST POPULAR ARTICLES
1-) Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnectsI Panchenko, K Croes, I De Wolf, J De Messemaeker, E Beyne, KJ WolterMicroelectronic engineering 117, 26-34, 2014592014
2-) Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation studyKB Yeap, E Zschech, UD Hangen, T Wyrobek, LW Kong, A Karmakar, ...Journal of Materials Research 27 (1), 339-348, 2012302012
3-) Enabling D2W/D2D hybrid bonding on manufacturing equipment based on simulated process parametersC Rudolph, A Hanisch, M Voigtländer, P Gansauer, H Wachsmuth, ...2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 40-44, 2021132021
4-) Grain Structure Analysis of Cu/SiO2 Hybrid Bond Interconnects after Reliability TestingI Panchenko, L Wambera, M Mueller, C Rudolph, A Hanisch, I Bartusseck, ...2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-7, 2020182020
5-) Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integrationI Panchenko, S Bickel, J Meyer, M Mueller, JM WolfJapanese Journal of Applied Physics 57 (2S1), 02BC05, 2017172017