Jae Choon Kim

Jae Choon Kim

Samsung Electronics, South Korea - / South Korea
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4456245
삼성전자, 한국
person_outline Jae Choon Kim's MOST POPULAR ARTICLES
1-) Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materialsS Ki, J Shim, S Oh, E Koh, D Seo, S Ryu, J Kim, Y NamInternational Journal of Heat and Mass Transfer 170, 121012, 2021542021
2-) Advanced fan-out package SI/PI/thermal performance analysis of novel RDL packagesSH You, S Jeon, D Oh, K Kim, J Kim, SY Cha, GB Kim2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1295-1301, 2018542018
3-) Thermoelectric cooling packages and thermal management methods thereofJC Kim, J Kim, J Bae, E ChoUS Patent 9,228,763, 2016502016
4-) Recent advances in thermal metamaterials and their future applications for electronics packagingJC Kim, Z Ren, A Yuksel, EM Dede, PR Bandaru, D Oh, J LeeJournal of Electronic Packaging 143 (1), 010801, 2021472021
5-) Electronic systems including heterogeneous multi-core processors and methods of operating sameMS Ahn, KS Yu, JC Kim, CG Oh, MK YimUS Patent 9,588,577, 2017402017