Jaewon Kim

Jaewon Kim

A*STAR Singapore - Neuros / Singapore
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4561859
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person_outline Jaewon Kim's MOST POPULAR ARTICLES
1-) Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integrationEJ Jang, JW Kim, B Kim, T Matthias, YB ParkMetals and Materials International 17, 105-109, 2011472011
2-) Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bumpMH Jeong, JW Kim, BH Kwak, YB ParkMicroelectronic Engineering 89, 50-54, 2012452012
3-) Significant enhancement of antimicrobial activity in oxygen-deficient zinc oxide nanowiresA Elbourne, S Cheeseman, P Wainer, J Kim, AE Medvedev, KJ Boyce, ...ACS Applied Bio Materials 3 (5), 2997-3004, 2020312020
4-) Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bumpBH Kwak, MH Jeong, JW Kim, B Lee, HJ Lee, YB ParkMicroelectronic Engineering 89, 65-69, 2012342012
5-) Ultrasonic Spray Pyrolysis of Antimony‐Doped Tin Oxide Transparent Conductive CoatingsJ Kim, BJ Murdoch, JG Partridge, K Xing, DC Qi, J Lipton‐Duffin, ...Advanced Materials Interfaces, 2000655, 2020332020