Jan Vaes

Jan Vaes

Flemish Institute for Technological Research - Mol / Belgium
Others
AD Scientific Index ID: 4423432
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person_outline Jan Vaes's MOST POPULAR ARTICLES
1-) Method for producing interconnect structures for integrated circuitsC Huyghebaert, J Vaes, J Van OlmenUS Patent 8,252,659, 20122932012
2-) Solvents and supporting electrolytes in the electrocatalytic reduction of CO2M König, J Vaes, E Klemm, D PantIscience 19, 135-160, 20192562019
3-) 3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si viasB Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ...2006 International Electron Devices Meeting, 1-4, 20062552006
4-) Recent advances in industrial CO2 electroreductionOG Sánchez, YY Birdja, M Bulut, J Vaes, T Breugelmans, D PantCurrent Opinion in Green and Sustainable Chemistry 16, 47-56, 20192472019
5-) 3D stacked IC demonstration using a through silicon via first approachJ Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ...2008 IEEE International Electron Devices Meeting, 1-4, 20081822008