Jesselyn Alcain

Jesselyn Alcain

University of Santo Tomas - Manila / Philippines
Business & Management / Marketing
AD Scientific Index ID: 5339598
Unibersidad ng Santo Tomas
person_outline Jesselyn Alcain's MOST POPULAR ARTICLES
1-) A review: Application of adhesive bonding on semiconductor interconnection jointsS Suppiah, NR Ong, Z Sauli, K Sarukunaselan, JB Alcain, MM Shahimin, ...AIP Conference Proceedings 1885 (1), 201772017
2-) A Review on Electrically Conductive Adhesives in Electronic PackagingK George, A Thomas, N Shajimon, J Joseph, R PaulInt. J. Res. Appl. Sci. Eng. Technol 9, 440-452, 202162021
3-) A review on solder reflow and flux application for flip chipS Suppiah, NR Ong, Z Sauli, K Sarukunaselan, JB Alcain, ...AIP Conference Proceedings 1885 (1), 201762017
4-) A short review on thermosonic flip chip bondingS Suppiah, NR Ong, Z Sauli, K Sarukunaselan, JB Alcain, MM Shahimin, ...AIP conference proceedings 1885 (1), 201742017
5-) A crunch on thermocompression flip chip bondingS Suppiah, NR Ong, Z Sauli, K Sarukunaselan, JB Alcain, N Mahmed, ...AIP Conference Proceedings 1885 (1), 201722017