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Jianyu Pan
Ohio State University - Columbus / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 880943
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Jianyu Pan's MOST POPULAR ARTICLES
1-)
Correlation analysis between formation process of SF6 decomposed components and partial discharge qualitiesJ Tang, F Zeng, J Pan, X Zhang, Q Yao, J He, X HouIEEE Transactions on Dielectrics and Electrical Insulation 20 (3), 864-875, 20131312013
2-)
Decomposition characteristics of SF6 under thermal fault for temperatures below 400°CF Zeng, J Tang, Q Fan, J Pan, X Zhang, Q Yao, J HeIEEE Transactions on Dielectrics and Electrical Insulation 21 (3), 995-1004, 2014832014
3-)
7-kV 1-MVA SiC-based modular multilevel converter prototype for medium-voltage electric machine drivesJ Pan, Z Ke, M Al Sabbagh, H Li, KA Potty, W Perdikakis, R Na, J Zhang, ...IEEE Transactions on Power Electronics 35 (10), 10137-10149, 2020442020
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Hardware design of a 1.7 kV SiC MOSFET based MMC for medium voltage motor drivesH Li, K Potty, Z Ke, J Pan, Y Chen, F Zhang, M Al Sabbagh, W Perdikakis, ...2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 1649-1655, 2018542018
5-)
Relationship between decomposition gas ratios and partial discharge energy in GIS, and the influence of residual water and oxygenJ Tang, F Zeng, X Zhang, J Pan, Q Yao, X Hou, Y TangIEEE Transactions on Dielectrics and Electrical Insulation 21 (3), 1226-1234, 2014462014
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