Jiawei Zhang

Auburn University - Auburn / United States

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AD Scientific Index ID: 858599

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Jiawei Zhang's MOST POPULAR ARTICLES

1-) Encapsulation technologies for electronic applicationsH Ardebili, J Zhang, MG PechtWilliam Andrew, 20182072018

2-) Improved predictions of lead free solder joint reliability that include aging effectsM Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 20121352012

3-) Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch PackagesJ Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...Components, Packaging and Manufacturing Technology, IEEE Transactions on 3 …, 20131332013

4-) Correlation of reliability models including aging effects with thermal cycling reliability dataM Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall2013 IEEE 63rd Electronic Components and Technology Conference, 986-1004, 20131312013

5-) Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder JointsJCS Jiawei Zhang, Zhou Hai, SivasubramanianOrlando, F. L. "Journal of Surface Mount Technology." (2012). 25 (3), 19-28, 2012128*2012

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