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Jie-Hua Zhao
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Jie-Hua Zhao's MOST POPULAR ARTICLES
1-)
Low dielectric constant materials for ULSI interconnectsM Morgen, ET Ryan, JH Zhao, C Hu, T Cho, PS HoAnnual Review of Materials Science 30 (1), 645-680, 20004912000
2-)
Circuit device with at least partial packaging and method for formingGR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ...US Patent 6,838,776, 20052402005
3-)
Circuit device with at least partial packaging, exposed active surface and a voltage reference planeGR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ...US Patent 6,921,975, 20052242005
4-)
Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron filmsJH Zhao, T Ryan, PS Ho, AJ McKerrow, WY ShihJournal of Applied Physics 85 (9), 6421-6424, 19991751999
5-)
Packaging effects on reliability of Cu/low-k interconnectsG Wang, C Merrill, JH Zhao, SK Groothuis, PS HoIEEE Transactions on Device and Materials Reliability 3 (4), 119-128, 20031562003
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