Jiebin Gu

Jiebin Gu

Shanghai Institute of Microsystem and Information Technology - Shanghai / China
Others
AD Scientific Index ID: 4815739
上海微系统和信息技术研究所
person_outline Jiebin Gu's MOST POPULAR ARTICLES
1-) Through-glass-via based microstrip band-pass filters fabricated with wafer-level low-melting-point alloy micro-castingW Zhang, J Gu, L Li, X LiIEEE Electron Device Letters 41 (7), 1106-1109, 2020192020
2-) A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnectionJ Gu, WT Pike, WJ KarlJournal of Micromechanics and Microengineering 19 (7), 074005, 2009172009
3-) Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge ruptureJ Gu, B Liu, G Chen, X LiJournal of Micromechanics and Microengineering 26 (7), 075009, 2016112016
4-) An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposerW Zhang, J Gu, G Xu, L Luo, X LiMicroelectronics Journal 101, 104798, 2020112020
5-) Solder pump technology for through-silicon via fabricationJ Gu, WT Pike, WJ KarlJournal of microelectromechanical systems 20 (3), 561-563, 2011112011