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Jinseong Kim
Qualcomm Ireland - Dublin / Ireland
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AD Scientific Index ID: 4457317
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Jinseong Kim's MOST POPULAR ARTICLES
1-)
Semiconductor device and fabricating method thereofJS Kim, DJ Park, KH Kim, YS AhnUS Patent 8,525,318, 20131402013
2-)
Application of through mold via (TMV) as PoP base packageJ Kim, K Lee, D Park, T Hwang, K Kim, D Kang, J Kim, C Lee, C Scanlan, ...2008 58th Electronic Components and Technology Conference, 1089-1092, 2008842008
3-)
Semiconductor package and manufacturing method thereofJS Kim, EJ Adlam, LE Bancod, GJ Kim, R Lanzone, JU Lee, YW Lee, ...US Patent 10,872,879, 2020322020
4-)
Next Generation Package-on-Package (PoP) Platform with Through Mold Via (TMV™) Interconnection TechnologyC Zwenger, L Smith, JS KimIMAPS Device Packaging Conference, 2009322009
5-)
Semiconductor package and manufacturing method thereofJS Kim, EJ Adlam, LE Bancod, GJ Kim, R Lanzone, JU Lee, YW Lee, ...US Patent 10,163,867, 2018292018
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