Jinzi Cui

Jinzi Cui

Auburn University - Auburn / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 5699109
person_outline Jinzi Cui's MOST POPULAR ARTICLES
1-) Reliability of Ag sintering for power semiconductor die attach in high-temperature applicationsF Yu, J Cui, Z Zhou, K Fang, RW Johnson, MC HamiltonIEEE Transactions on Power Electronics 32 (9), 7083-7095, 20161362016
2-) Investigation of thick film technology for high temperature applicationsZ Zhou, J Cui, F Yu, K Fang, Z Shen, RW Johnson, A Vert, T Zhang, ...Additional Papers and Presentations 2012 (HITEC), 000184-000191, 201292012
3-) Evaluation of thick-film materials for high-temperature packagingZ Zhou, J Cui, F Yu, RW Johnson, MC HamiltonIEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 201882018
4-) Reliability of AuGe die attach on DBC substrates with different Ni surface finishesJ Cui, RW Johnson, MC HamiltonIEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 201742017
5-) Reliability of die attach on DBC substrates with different Ni surface finishes using BiAgX solderJ Cui, RW Johnson, MC HamiltonIEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 201732017